Superfine Conductive Nano Silver powder

Inkcazelo emfutshane:

Inombolo yoMfanekiso:HR-Ag

Ubunyulu:≥99.95%

Impahla engekasilwa:intonga yesilivere

Iinkcukacha:Nano kunye neMicro

Ukuhanjiswa kobungakanani beNcam:D50-3 Micron

App.Ubuninzi:0.95g/cm3

Ubume:umgubo

Imorphology:i-spherical, i-flake, i-fibrous

Umbala:isilivere engwevu

Isicelo:intlama eqhubayo, i-inki eqhubayo, imathiriyeli yokukhusela i-electromagnetic, i-antibacterial agent, njl

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Ingcaciso yeMveliso

I-powder yethu yesilivere ineempawu zokuxinana kobuninzi obuphantsi, ukuhanjiswa kombane okuphezulu, ukuguquguquka okuhle kunye nokumelana ne-oxidation.I-Flake yesilivere engumgubo yinto efanelekileyo yokulinganisa i-polymer, i-conductive coatings, kunye ne-electromagnetic shielding coatings.Ukugquma ngeflake umgubo wesilivere une-fluidity elungileyo, i-anti-settlement kunye nendawo enkulu yokutshiza.

Inkcazo

IBanga	Iimpawu zeMorphology	Ukuhanjiswa kobungakanani beNcam	Uxinzelelo olubonakalayo
HR401NS	I-Spherical	D50=55nm	0.35 g/cm3
HR402NS	I-Spherical	D50=55nm	1.25 g/cm3
HR403NS	I-Spherical	D50=150nm	1.35 g/cm3
HR404NS	I-Spherical	D50=230nm	1.25 g/cm3
HR405NS	I-Spherical	D50=200nm	1.55 g/cm3
HR501NS	I-Dendritic	D50=175nm	1.45 g/cm3
HR502NS	I-Dendritic	D50=320nm	1.37 g/cm3
HR503NS	I-Dendritic	D50=55nm	0.35 g/cm3
HR504NS	I-Dendritic	D50=55nm	0.35 g/cm3
HR505NS	I-Dendritic	D50=55nm	0.35 g/cm3
HR601NS	I-Fibrous	Ububanzi 15nm, Ubude 2 ~ 3um	2.15 g/cm3
HR602NS	I-Fibrous	Ububanzi 35nm Ubude 1 ~ 3um	1.75 g/cm3

Isicelo

Umgubo weflake wesilivere osetyenziswayo kwishishini le-elektroniki kunye ne-microelectronics, ii-inki eziqhubayo kunye nezinye iiCompounds ze-doped conductive, njl.

I-Nano powder yesilivere isetyenziswa ikakhulu kwi-sintering paste;Umgubo wesilivere wemicron usetyenziswa ikakhulu kwi-inki eqhubayo kunye nokwaleka okuqhubayo.I-Sintering paste isetyenziswa ikakhulu kwi-electronics, capacitors, inductors, iglasi yefestile yemoto yangasemva;I-inki e-conductive isetyenziswa ikakhulu kwiibhodi zezitshixo, ukutshintshwa kwenwebu, imiboniso yefowuni ephathwayo, njl. njl. Ukwakhiwa kwe-sintering paste kunye ne-inki eqhubayo/i-conductive coating iyafana, equlunqwe ngentlaka, isinyibilikisi, umgubo wesilivere kunye nezongezelelo.Umahluko kukuba i-sintering paste iqulethe i-powder yeglasi, ngelixa i-inki ye-conductive ingenayo i-powder yeglasi.I-30nm kunye ne-250nm umgubo wesilivere ngowona usetyenziswa kakhulu kwintlama ye-sintering.

Umgubo wesilivere unokusetyenziswa njenge-antibacterial agent esetyenziswa kwiintlobo ezahlukeneyo zephepha, iplastiki, kunye nezongezo zelaphu.Inokusetyenziswa ngempumelelo ekwakheni, ukukhuselwa kwezinto zenkcubeko kunye neemveliso zonyango.