ISilver Coated Copper Powder Broad Prospects

Intlama ye-elektroniki sisixhobo esibalulekileyo esisisiseko sokwenza izinto zombane.Isetyenziswa ngokubanzi kwiimodyuli zelanga ze-photovoltaic, ukupakishwa kwe-chip, iisekethe eziprintiweyo, izinzwa kunye nokuchongwa kwamaza kanomathotholo kunye nezinye iinkalo.I-Silver paste yeyona nto ibalulekileyo kwaye isetyenziswa ngokubanzi intlama eqhubayo, enobungakanani bemarike obungamashumi eebhiliyoni.Nangona kunjalo, isilivere yintsimbi exabisekileyo kwaye iyabiza, ngoko ke kubaluleke kakhulu ukuphuhlisa ixabiso eliphantsi kunye nentsebenzo ephezulu yeemveliso zokunamathisela isilivere.I-Copper, eneempawu ezifanayo zombane kunye ne-thermal kwisilivere, i-1% kuphela yexabiso lesilivere.Nangona kunjalo, ubhedu lula oxidized emoyeni, ngoko sintering okanye ukunyanga kufuneka kuqhutywe phantsi kokhuseleko iigesi inert (ezifana nitrogen, argon, njl.), leyo kakhulu imida ukusetyenziswa kwayo kwintsimi intlama electronic.Ke ngoko, isilivere efakwe umgubo wobhedu othathela ingqalelo zombini ixabiso kunye nokusebenza kuya kuba lukhetho oluhle.

Ubhedu olugutyungelwe yisilivere luthatha itekhnoloji yamasuntswana obhedu agqunywe ngesilivere, anamandla amakhulu entengiso.Imveliso ye-Huarui isebenzisa i-electroplating ukuze yenze i-uniform kunye ne-shiny yesilivere yokugquma phezu kwamasuntswana obhedu obhedu, anokunciphisa ngokufanelekileyo inani lesilivere esetyenzisiweyo kwaye ngaloo ndlela inciphise iindleko zokunamathisela, kwaye ithintele ukuchasana kwamasuntswana obhedu ekunyukeni ngenxa ye-oxidation yomhlaba. ngexesha sintering, njalo njalo umbuzo.(Xa kuthelekiswa neendlela zekhemikhali, i-electroplating inomaleko wesilivere oxineneyo kunye nokumelana ne-oxidation engcono).Umxholo wesilivere unokulungelelaniswa ngokomlinganiselo we-r0 kunye ne-r1 radii, ngokuqhelekileyo umxholo wesilivere wobhedu owenziwe ngesiliva uphakathi kwe-10% kunye ne-30%.

U-Ag uqatywe uCu umgubo

Iimpawu zomgubo wobhedu oqatywe ngesilivere:

I-1) Ubungakanani be-particle ye-powder yethusi enesilivere encinci, ukuya kwinqanaba le-submicron.

I-2) I-powder yethusi efakwe ngesilivere ine-morphology eninzi, kuquka ibhola, ishidi, i-dendritic kunye nokunye.

Ag coated Cu umgubo SEM

3) Umgubo wobhedu oqatywe ngesilivere unokuhanjiswa kombane okugqwesileyo kunye nexabiso eliphantsi, elinokuthi lithathe indawo yezinye iindawo zokusetyenziswa komgubo wesilivere.

4) Umgubo wobhedu ogqunywe ngesilivere unokumelana ne-oxidation elungileyo kunye nokusasazwa, kwaye ingasetyenziswa kwintlama yobushushu obuphakathi kunye nesezantsi.

I-powder yobhedu efakwe kwisilivere ingasetyenziselwa ukunamathiswa kwe-conductive, i-conductive coatings, i-inki eqhubayo, i-polymer pastes, kunye nemimandla eyahlukeneyo yeteknoloji ye-microelectronics efuna i-conductivity kunye nombane we-static, kunye ne-non-conductive material surface metallization.Luhlobo olutsha lwePowder edibeneyo edibeneyo.Umgubo wobhedu ocatyiswe yisilivere usetyenziswa ngokubanzi kwi-elektroniki, kumatshini kunye nombane, unxibelelwano, ushicilelo, i-aerospace, umkhosi kunye namanye amashishini okuqhuba, amasimi okukhusela i-electromagnetic.Njengeekhompyuter, iiselfowuni, iisekethe ezidityanisiweyo, zonke iintlobo zezixhobo zombane, izixhobo zonyango zombane, izixhobo zombane kunye nezinye iimveliso eziqhubayo, ukukhusela i-electromagnetic.

I-Chengdu Huarui Industrial Co., Ltd.

Email: sales.sup1@cdhrmetal.com

Ifowuni: + 86-28-86799441


Ixesha lokuposa: Jan-17-2023